Gold Member Since 2013
Audited Supplier
Shenzhen Grandseed Technology Development Co., Ltd.

Bga Reflow Soldering Oven, Smt Reflow Oven, Reflow Soldering Machine manufacturer / supplier in China, offering Gsd-L8 BGA Reflow Soldering Oven, SMT Reflow Oven Gsd-M8n, SMT Wave Soldering Gsd-Wd350r and so on.

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Supplier Homepage Product Reflow Oven Gsd-L8 BGA Reflow Soldering Oven

Gsd-L8 BGA Reflow Soldering Oven

Purchase Qty.:
(sets)
1-11,165 11,166-11,499 11,500-11,832 11,833-11,999 12,000+
FOB Unit Price: US $18,300 US $19,580 US $20,300 US $19,500 US $25,300
Purchase Qty. (sets) FOB Unit Price
1-11,165 US $18,300
11,166-11,499 US $19,580
11,500-11,832 US $20,300
11,833-11,999 US $19,500
12,000+ US $25,300
Get Latest Price
Production Capacity: 24000sets/Year
Transport Package: Vacuum Packing +Wood
Payment Terms: L/C, T/T, D/P, Paypal, Money Gram, Western Union

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Basic Info
  • Model NO.: big-size reflow oven gsd-L8
  • Warranty: 4 Years
  • Large-Size Reflow Oven: 5500 L/1500 W/1550 H Mm
  • Easy Control Reflow Solering Machine: Computer +PLC
  • Temperature Accuracy: ±1 Centigrade
  • Convey Speed: 0-2000mm/ Min
  • Net Weight: 1870 Kg
  • Demoulding: Automatic
  • Customized: Customized
  • Mould Life: 300,000-1,000,000 shots
  • Trademark: GRAND SEED
  • Origin: Shenzhen Guangdong
  • Certification: CE, ISO, RoHS
  • Automatic Grade: Automatic
  • Energy- Saving Reflow Machine: 16 Heating Zones
  • Heating/Cooling: 16 Heating Zone 2 Cooling Zone
  • PCB Size: 50-400 Mm
  • Power Supply: AC380V 50 Hz
  • Precision: High Precision
  • Function: High Temperature Resistance
  • Condition: New
  • Heating System: Pid Infrared Ray
  • Specification: CE, RoHS, ISO
Product Description

GSD-L8 Lead Free Reflow Oven 
         control by computer+ PLC,16 heating zones ,                                  2 cooling zones



                                                                            

Features:



1......... Windows operating interface is adopted and two control methods,including PC control and emergency manual control, are designed to ensure the safety of the device.


2...........The advanced way of heating solves the problem of the dead angle that may arise when reflow soldering.


3............Professional wind wheel design with stable blowing speed which effectively avoids evenness of the wind when PCB is being heated.so as to achieve a most efficient reheating.


4.......Regions of different temperature adopt the circulation independent from each other,with independent PID control and up/down heating method method,so as to ensure the accurate and even temperature of the  furnace and large thermal capacity.


5......... The heating preservation layer adopts quality aluminum silicate heat preserving material,with good preservation effect and high heatingup speed.It takes 20minto heat up working temperature from room temperature.


6....... Quality hightemperature highspeed motor is running stably with light vibration and low noise


7........The furnace is jacked by cylinder and supported by safety rod to ensure safety and convenience.


8.........The PCB is conveyed nonlevel with changed frequency and speed and synchronous grid and chain to ensure great stability.


9............. Special quality aluminum alloy guide rail is adopted and auto fuel feeding system ensures the debugging accuracy of the guild rail as well as its use life.


10.............UPS function is equipped to ensure normal output of PCB after power break and avoid damage


11............The software has powerful function.It can measure the temperature of the PCB online and can analyze ,save and print the data and curve from time to time.


12..............PC and PLC adopts PC/PP protocol to communication with each other which ensures stable working and avoids system down.Auto detecting and showing working status of the device.


13.............Enforced air cooling ;PCB temperature≤60ºC.


14..............Special furnace liner design ,with good heat preservation ability and low power       consumption.










ITEMS
 
SPECIFICATIONS
Control system
 
PC+PLC
Heating/cooling
 
16 heating zone  2 cooling zone
Heating zone length
 
2950mm
Temperature range
 
Room temperature-350 centigrade
Temperature accuracy
 
±1 centigrade
Three temperature
 
±2 centigrade 
Cooling
 
Forced cooling (patent cooling system)
PCB size
 
50(W)-420mm(W)
A high degree of PCB transfer
 
900±20mm
Transmission
 
Chain&belt
Transmission direction
 
L→R
Transmission speed
 
0-2000mm/min  adjustable
Wide range of track notes
 
50-420mm
Net width
 
500mm
Power failure   protection
 
UPS
Power supply
 
A3ø380V 50HZ
Normal working power/total power consumption11/73KW
 
Dimensions(l*w*h)
 
5500mm(L)*1500mm(W)*1550mm(H)
Weight

 
1870KG


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