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Shenzhen Grandseed Technology Development Co., Ltd.

Bga Reflow Oven, Bga Reflow Soldering, Reflow Oven manufacturer / supplier in China, offering BGA Reflow Oven (GSD-L12), Mc812 Pick and Place Machine, H810 Pick and Place Machine and so on.

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BGA Reflow Oven (GSD-L12)

FOB Price: Get Latest Price
Min. Order: 1 Set
Production Capacity: 2000piece/Year
Transport Package: Export Packing
Payment Terms: T/T, Western Union

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Basic Info
  • Model NO.: GSD-L12
  • Heating/Cooling: 16 Heating Zone 2 Cooling Zone
  • Temperature Range: Room Temperature-350 Degree
  • Wide Range of Track Notes: 50-500mm
  • Normal Working Power/Total Power Consump: 4/73kw
  • Weight: 1800kg
  • Specification: CE, RoHS, ISO9001
  • HS Code: 8515190000
  • Control System: PC+PLC
  • Heating Zone Length: 2950mm
  • Temperature Accuracy: 1 Degree
  • Power Supply: 3phase;380V 50Hz
  • Dimensions(L*W*H): 5500mm(L)*1500mm(W)*1550mm(H)
  • Trademark: GRANDSEED
  • Origin: Shenzhen China
Product Description

Features:

windows operating interface is adopted and two control methods,including PC control and emergency manual control, are designed to ensure the safety of the device.

The advanced way of heating solves the problem of the dead angle that may arise when reflow soldering.

Professional wind wheel design with stable blowing speed which effectively avoids evenness of the wind when PCB is being heated.so as to achieve a most efficient reheating.

Regions of different temperature adopt the circulation independent from each other,with independent PID control and up/down heating method method,so as to ensure the accurate and even temperature of the furnace and large thermal capacity.

The heating preservation layer adopts quality aluminum silicate heat preserving material,with good preservation effect and high heating-up speed.It takes 20min to heat up working temperature from room temperature.

Quality high-temperature high-speed motor is running stably with light vibration and low noise

The furnace is jacked by cylinder and supported by safety rod to ensure safety and convenience.

The PCB is conveyed non-level with changed frequency and speed and synchronous grid and chain to ensure great stability.

Special quality aluminum alloy guide rail is adopted and auto fuel feeding system ensures the debugging accuracy of the guild rail as well as its use life.

UPS function is equipped to ensure normal output of PCB after power break and avoid damage.

The software has powerful function.It can measure the temperature of the PCB online and can analyze ,save and print the data and curve from time to time.

PC and PLC adopts PC/PP protocol to communication with each other which ensures stable working and avoids system down.Auto detecting and showing working status of the device.

Enforced air cooling ;PCB temperature≤60°C.

Special furnace liner design ,with good heat preservation ability and low power consumption.

 


BGA Reflow Oven (GSD-L12)


BGA Reflow Oven (GSD-L12)



ITEMS

SPECIFICATIONS   

Control  system

PC+PLC

Heating/cooling

24  heating  zone    2  cooling  zone

Heating  zone  length

3550mm

Temperature  range

R oom  temperature-350° C

Temperature  accuracy

± 1° C

Three  temperature

± 2° C

Cooling

F orced  cooling  (patent  cooling  system)

P CB   size

50(W)-400mm(W)

A   high  degree  of  PCB  transfer

900± 20mm

Transmission

C hain& belt

Transmissio n   direction

L→ R(R→ L)

Transmission  speed

0-2000mm/min    adjustable

Wide  range  of  track  n otes

50-500mm

N et  width

460mm

Power  failure       protection   

UPS

Power  supply

A3ø 380V  50HZ

Normal  working  power/total  power  consumption

8/91KW

Dimen s ions(l*w*h)

6100mm(L)*1500mm(W)*1550mm(H)

Weight

2350KG

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